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Infineon Technologies DEMO_HV_PACKAGE Evaluation Board
Infineon Technologies DEMO_HV_PACKAGE Board enables designers to integrate bottom- and top-side cooled power packages efficiently into applications. This board assembly reduces design complexity to deliver optimal thermal performance while maximizing efficiency and achieving high power density. The DEMO_HV_PACKAGE board features reliability and scalability, enabling compact designs for high-performance power applications. This board features an improved power loop design, innovative cooling concepts such as BSC and TSC, an optimized half-bridge design, and lower stray inductance.