Waffle Passive Bauteile

Signalaufbereitung The MPD-0422SCSP2 is a small footprint MMIC 4-22 GHz 2-Way power divider/power splitter featuring high 22 dB isolation and low 0.9 dB insertion loss in our compact CSP2 chip scale package.

Signalaufbereitung The MPD4-0R404CSP2 is a small footprint MMIC 0.4-4 GHz 4-Way power divider/power splitter featuring high 20 dB isolation and 3.4 dB insertion loss in our compact CSP2 chip scale package.

Signalaufbereitung The MBAL-0220CSP2 is a GaAs passive MMIC balun featuring a frequency range of 2 to 20 GHz. This balun offers low 1.9 dB insertion loss as a mode converter, excellent balance and 27 dB common mode rejection in a compact 2.5 mm CSP2 chip scale package.

Antennen Stamped Metal WiFi 6 E/7 & BT PCB

Signalaufbereitung The MPD4-0422CSP2 is a small footprint MMIC 4-22 GHz 4-Way power divider/power splitter featuring high 30 dB isolation and low 1 dB insertion loss in our compact CSP2 chip scale package.

Spezial-Keramikkondensatoren 100Volts 820pF 20% S ingle Layer Cap

Signalaufbereitung MPD-0226SM is a MMIC 2-way Wilkinson power divider. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. The MPD-0226SM is available as a 4 X 4 mm QFN package.

Dickfilmwiderstände - SMD CHPHT 0603 100PPM 49U9 1% G TR e4

Keramik-Vielschichtkondensator MLCC – bedrahtet 500V 2uF C0G 10%

Keramik-Vielschichtkondensator MLCC – bedrahtet 2000VDC 0.018uF C0G 10% LS=6.35mm

Spezial-Keramikkondensatoren AVX/ATC SLC FINISHED

Spezial-Keramikkondensatoren 50Volts10nF 20% Single Layer Cap