Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.

Ergebnisse: 6
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Produkt Länge Breite Höhe
Advanced Thermal Solutions Wärmeableitungen Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x20mm 158Auf Lager
Min.: 1
Mult.: 1

Advanced Thermal Solutions Wärmeableitungen Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x10mm 352Auf Lager
Min.: 1
Mult.: 1

BGA Heat Sink 54 mm 68 mm 20 mm
Advanced Thermal Solutions Wärmeableitungen maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x9.76mm 93Auf Lager
Min.: 1
Mult.: 1

Advanced Thermal Solutions Wärmeableitungen maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x25mm 104Auf Lager
Min.: 1
Mult.: 1

Advanced Thermal Solutions Wärmeableitungen Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x10mm 86Auf Lager
Min.: 1
Mult.: 1

Advanced Thermal Solutions Wärmeableitungen Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x20mm 29Auf Lager
100erwartet ab 27.03.2026
Min.: 1
Mult.: 1