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Wakefield Thermal 900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.

Features

  • AL 6063 construction material
  • Black anodized finish
  • RoHS compliant
  • Compatible with various devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more

Applications

  • Telecom
  • Data centers
  • Networking
  • Cloud computing

Board Application

Infographic - Wakefield Thermal 900 Series Elliptical Fin Heat Sinks

Mechanical Drawing

Mechanical Drawing - Wakefield Thermal 900 Series Elliptical Fin Heat Sinks

Assembly Instructions

Infographic - Wakefield Thermal 900 Series Elliptical Fin Heat Sinks

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Veröffentlichungsdatum: 2024-05-29 | Aktualisiert: 2024-09-03