iWave Global SODIMM Heat Sink
iWave Global SODIMM Heat Sink is intended for SODIMM i.MX8M Mini/Nano, Zynq 7000, RZ/G1E, i.MX6 modules. The SODIMM Heat Sink consists of aluminum material in a 67.5mm x 31.5mm package. The device uses a silicone elastomer as a thermal gap pad between the CPU and the heat sink. The Heat Sink is lightweight and rugged, designed to be easily attached to the iWave’s Qseven system on modules.
Features
- 67.5mm x 31.5mm package
- Aluminum material
- Silicone elastomer as a thermal gap pad
- Rugged and lightweight
Applications
- SODIMM i.MX8M Mini module
- SODIMM Nano, Zynq 7000, RZ module
- SODIMM G1E, i.MX6 module
Package Overview
Veröffentlichungsdatum: 2020-03-30
| Aktualisiert: 2026-01-22