Wakefield Thermal Empfohlene Produkte

Thermally conductive electrical insulators for semiconductor-to-heat sink interfaces

Features 360W maximum power draw at 24V_DC and vertical orientation within 30°.

Features a hermetically sealed refrigeration system with a miniature variable-speed compressor.

Features a solid-state welding method, which seamlessly joins metal pieces without melting them.

Widely used to bond heat sinks to microprocessors and other power-consuming semiconductors.

Compatible with the industry’s power module devices, such as SiCs, GaNs, IGBTs, and SCRs.

High-performance, non-silicone thermal grease syringe with 6W/m-K thermal conductivity.

Two-ball bearing system, 10MΩ insulation resistance, and a -10°C to +70°C temperature range.

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