SMD/SMT Multiprotocol Modules

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Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Antenna Connector Type
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - Cellular, NBIoT, LTE
Protocol - GPS, GLONASS
Protocol - Sub GHz
Protocol - WiFi - 802.11
Protocol - ANT, Thread, Zigbee - 802.15.4
Packaging
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, Integrated Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, No Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, Integrated Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 1

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs Multiprotocol Modules 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 1

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 1 000
Mult.: 1 000
: 1 000

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 1 000
Mult.: 1 000
: 1 000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 1 000
Mult.: 1 000
: 1 000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 1 000
Mult.: 1 000
: 1 000

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 1 000
Mult.: 1 000
: 1 000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
Non-Stocked Lead-Time 23 Weeks
Min.: 1 000
Mult.: 1 000
: 1 000

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Reel
Silicon Labs Multiprotocol Modules SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 8MB Flash in IC package?
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 700
: 700

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel
Silicon Labs Multiprotocol Modules SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 Integrated Antenna, 2MB PSRAM in IC package, 8MB Flash in module
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 1
Mult.: 1
: 700

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel, Cut Tape
Silicon Labs Multiprotocol Modules SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 Integrated Antenna, 4MB Flash in IC package?
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 700
: 700

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel
Silicon Labs Multiprotocol Modules SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
Datasheet
Non-Stocked Lead-Time 50 Weeks
Min.: 700
Mult.: 700
: 700

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Reel
NXP Semiconductors Multiprotocol Modules AW693PHNB/A1ZDB Non-Stocked Lead-Time 16 Weeks
Min.: 840
Mult.: 840

2.4 GHz, 5 GHz to 7 GHz UART 11 mm x 11 mm x 0.85 mm Bluetooth 5.3 Wi-Fi 6/6E Tray
NXP Semiconductors Multiprotocol Modules IW610BHN/A1ZDI
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2 700
Mult.: 2 700
: 2 700

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel
NXP Semiconductors Multiprotocol Modules IW610CHN/A1ZDI
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2 700
Mult.: 2 700
: 2 700

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel
NXP Semiconductors Multiprotocol Modules IW610FHN/A1ZDI
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1 300
Mult.: 1 300

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Multiprotocol Modules IW610GHN/A1ZDI
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1
Mult.: 1
: 2 700

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotocol Modules IW611HN/A1C
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1 300
Mult.: 1 300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray
NXP Semiconductors Multiprotocol Modules IW611HN/A1I
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 1 300
Mult.: 1 300

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Tray