Bluetooth, BLE Multiprotokoll-Module

Ergebnisse: 38
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Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – Mobilfunk, NBIoT, LTE
Protokoll – GPS, GLONASS
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Produkt
Verpackung
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
5Auf Lager
Min.: 1
Mult.: 1
: 1 000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610BUK/A1ZDI
Datenblatt
25Auf Lager
Min.: 1
Mult.: 1
: 2 000

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel, Cut Tape
Espressif Systems Multiprotokoll-Module SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Datenblatt
1 177Auf Lager
8 450Auf Bestellung
Min.: 1
Mult.: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules
Espressif Systems Multiprotokoll-Module SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
Datenblatt
797Auf Lager
11 700Auf Bestellung
Min.: 1
Mult.: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
3 466Auf Lager
6 000erwartet ab 22.01.2027
Min.: 1
Mult.: 1
: 1 000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape


Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
62Auf Lager
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
177Auf Lager
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
110Auf Lager
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
31Auf Lager
100erwartet ab 09.10.2026
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
144Auf Lager
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
23Auf Lager
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
998Auf Lager
Min.: 1
Mult.: 1
: 1 000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
687Auf Lager
Min.: 1
Mult.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
2 626Auf Lager
Min.: 1
Mult.: 1
: 1 000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
268Auf Lager
Min.: 1
Mult.: 1

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
20Auf Lager
1 100Auf Bestellung
Min.: 1
Mult.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
100Auf Lager
200erwartet ab 22.01.2027
Min.: 1
Mult.: 1

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610FUK/A1ZDI
Datenblatt
25Auf Lager
Min.: 1
Mult.: 1
: 2 000

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel, Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
4 000erwartet ab 22.01.2027
MouseReel verfügbar
Min.: 1
Mult.: 1
: 1 000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape, MouseReel
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
1 000erwartet ab 25.09.2026
Min.: 1
Mult.: 1
: 1 000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
600erwartet ab 22.01.2027
Min.: 1
Mult.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610BHN/A1ZDI
Datenblatt
25erwartet ab 29.10.2026
Min.: 1
Mult.: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Tray
NXP Semiconductors Multiprotokoll-Module IW610FHN/A1ZDI
Datenblatt
25erwartet ab 29.10.2026
Min.: 1
Mult.: 1
: 2 700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel, Cut Tape
Quectel Multiprotokoll-Module
20Auf Bestellung
Min.: 1
Mult.: 1
- 40 C + 85 C 16.6 mm x 13 mm x 2.05 mm Bluetooth, BLE IEEE802.11 a/b/g/n/ac
u-blox Multiprotokoll-Module Secure industrial Wi-Fi and Bluetooth u-connectXpress software and internal antenna
Datenblatt
Nicht auf Lager
Min.: 500
Mult.: 500
: 500

NINA-W15 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3.3 V 3.3 V - 40 C + 85 C PCB 10 mm x 14 mm x 2.2 mm Bluetooth, BLE 802.11 b/g/n WiFi, BLE Modules Reel