|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-04-1-K-TR
- Samtec
-
475:
€ 8,22
-
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM20010L041KTR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
|
Min.: 475
Mult.: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-06-1-K-TR
- Samtec
-
325:
€ 9,79
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
Mouser-Teilenr.
200-LPAM20010L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-2-K-TR
- Samtec
-
1:
€ 17,76
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-LPAM20010L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
€ 17,76
|
|
|
€ 16,98
|
|
|
€ 16,34
|
|
|
€ 15,14
|
|
|
€ 11,86
|
|
|
Anzeigen
|
|
|
€ 13,01
|
|
|
€ 11,32
|
|
|
€ 10,89
|
|
|
Kostenvoranschlag
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-04-2-K-TR
- Samtec
-
475:
€ 8,74
-
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
|
Mouser-Teilenr.
200-LPAM20010S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
|
|
Min.: 475
Mult.: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-06-1-K-FR
- Samtec
-
325:
€ 9,48
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM20010S061KFR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-06-1-K-TR
- Samtec
-
1:
€ 15,47
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM20010S061KTR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
|
€ 15,47
|
|
|
€ 14,80
|
|
|
€ 14,24
|
|
|
€ 13,20
|
|
|
€ 10,88
|
|
|
Anzeigen
|
|
|
€ 11,34
|
|
|
€ 10,64
|
|
|
€ 10,63
|
|
|
Kostenvoranschlag
|
|
Min.: 1
Mult.: 1
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-06-2-K-TR
- Samtec
-
325:
€ 10,55
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
Mouser-Teilenr.
200-LPAM20010S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-2-K-TR
- Samtec
-
300:
€ 13,87
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM20010S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-04-1-K-TR
- Samtec
-
450:
€ 8,39
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM20015L041KTR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-20-01.5-L-08-2-K-TR
- Samtec
-
1:
€ 18,14
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM20015L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM LP ARRAY HS HD LOW PRO
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
|
€ 18,14
|
|
|
€ 17,35
|
|
|
€ 16,68
|
|
|
€ 15,47
|
|
|
€ 11,73
|
|
|
Anzeigen
|
|
|
€ 13,29
|
|
|
€ 11,24
|
|
|
€ 11,02
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-04-1-K-TR
- Samtec
-
450:
€ 9,10
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
Mouser-Teilenr.
200-LPAM20015S041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-04-2-K-TR
- Samtec
-
450:
€ 8,23
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM20015S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-06-1-K-TR
- Samtec
-
300:
€ 11,22
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
Mouser-Teilenr.
200-LPAM20015S061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-06-2-K-TR
- Samtec
-
300:
€ 11,09
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
Mouser-Teilenr.
200-LPAM20015S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-1-K-TR
- Samtec
-
1:
€ 20,12
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
Mouser-Teilenr.
200-LPAM20015S081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
|
€ 20,12
|
|
|
€ 19,24
|
|
|
€ 18,52
|
|
|
€ 17,16
|
|
|
€ 13,85
|
|
|
Anzeigen
|
|
|
€ 14,74
|
|
|
€ 13,47
|
|
|
€ 13,29
|
|
|
Kostenvoranschlag
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-04-2-K-FR
- Samtec
-
475:
€ 8,63
-
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM30010L042KFR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
|
Min.: 475
Mult.: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-1-K-TR
- Samtec
-
325:
€ 11,47
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM30010L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-2-K-FR
- Samtec
-
325:
€ 11,60
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM30010L062KFR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-08-1-K-TR
- Samtec
-
325:
€ 14,84
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAM30010L081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-04-2-K-TR
- Samtec
-
475:
€ 10,39
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM30010S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 475
Mult.: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-06-2-K-TR
- Samtec
-
325:
€ 12,93
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM30010S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-08-1-K-TR
- Samtec
-
325:
€ 16,16
-
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
Mouser-Teilenr.
200-LPAM30010S081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-08-2-K-TR
- Samtec
-
325:
€ 16,25
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM30010S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-1-K-FR
- Samtec
-
450:
€ 9,74
-
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAM30015L041KFR
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
|
|
Min.: 450
Mult.: 450
:
450
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LPAM
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Reel
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Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-1-K-TR
- Samtec
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450:
€ 9,73
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Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM30015L041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
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Headers
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1.27 mm (0.05 in)
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Solder
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Straight
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2.2 A
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250 V
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- 55 C
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+ 125 C
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Gold
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Copper Alloy
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Liquid Crystal Polymer (LCP)
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LPAM
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Reel
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Österreich