Wärmeableitungen Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole.

Wärmeableitungen Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.

Computer-On-Module - COM COM HPC Size A module with Intel Core i3-1115GRE Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.

Wärmeableitungen Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0

Wärmeableitungen Standard Heat spreader for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole

Computer-On-Module - COM JUMPtec HSP COMe-cWL6 Cu-core through

Computer-On-Module - COM JUMPtec COMe-mBTc10 E3815 1GB/2S

Wärmeableitungen HSP COMe-mBT10 through

Computer-On-Module - COM COM-HPC Mini module based on Intel Core i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 12MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor

Wärmeableitungen HSP COMe-mAL10 E2 thread

CPU- und Chip-Kühler HSP COMe-cAP6 Cu-core threaded

Computer-On-Module - COM Qseven 2.0 module based on Intel Atom x7 E3950 SoC (Itemp Quad-core, 12W TDP, CPU freq. 1.6/2.0GHz, GPU 18EU freq. 500/650MHz) with on-board memory 8GB DDR3L-1866 and 32GB eMMC.