All Results (1 094)

Computer-On-Modules - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.

Heat Sinks Standard heatspreader for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.

CPU & Chip Coolers Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread

Heat Sinks HSP COMe-mAL10 E2 slim through

Computer-On-Modules - COM JUMPtec COMe mMount Kit 5/8mm 1set

Computer-On-Modules - COM COM Express Mini Type10 module with Intel Atom x5-E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz 2MB L2 cache 4GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.

Computer-On-Modules - COM JUMPtec HSK COMe-bDV7 passive thread

Heat Sinks Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded

Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Core i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

Heat Sinks Standard passive cooling for COM Express Mini Type10 module conga-MA5* Heatstack cooling for modules with standard CPU (open silicone die)* All stand-offs are M2.5 threaded

CPU & Chip Coolers Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm.

CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.