2 Mb/s Multiprotokoll-Module

Ergebnisse: 98
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Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – GPS, GLONASS
Protokoll – Sub-GHz
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Verpackung
Silicon Labs Multiprotokoll-Module Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
Datenblatt
18Auf Lager
Min.: 1
Mult.: 1

MGM210P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Multiprotokoll-Module MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Datenblatt
37Auf Lager
Min.: 1
Mult.: 1

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Multiprotokoll-Module MGM220P wireless gecko
Datenblatt
40Auf Lager
Min.: 1
Mult.: 1

2.4 GHz 8 dBm Bluetooth, GPIO, I2C, UART 1.8 V 3.8 V - 40 C + 105 C Built-In 15 mm x 12.9 mm Bluetooth 5.2, Bluetooth Mesh Zigbee Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
990erwartet ab 10.07.2026
MouseReel verfügbar
Min.: 1
Mult.: 1
: 1 000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel
Fanstel Multiprotokoll-Module Mini nRF52811 BLE 5.4 module, 192KB flash,24KB RAM, high performance PCB antenna, approtect
Datenblatt
52Auf Lager
Min.: 1
Mult.: 1
: 1 000

BM833 2.4 GHz I2S 1.7 V 3.6 V - 40 C + 85 C 10.2 mm x 20.6 mm x 1.9 mm Reel, Cut Tape
Ezurio Multiprotokoll-Module BL5340 series - Multi-Core / Protocol Bluetooth + 802.15.4 + NFC Module (Nordic nRF52340) - Integrated Antenna (Tape/Reel)
Datenblatt
2 000erwartet ab 14.09.2026
Min.: 1
Mult.: 1
: 1 000

BL5340 2.4 GHz 3 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C Integrated 15 mm x 10 mm x 2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Multiprotokoll-Module Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
Datenblatt
2 000Auf Bestellung
Min.: 1
Mult.: 1
: 1 000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Ezurio Multiprotokoll-Module BL654 - Bluetooth v5 / 802.15.4 / NFC Module (Nordic nRF52840) External Antenna - Cut Tape
Datenblatt
250Auf Lager
Min.: 1
Mult.: 1

BL654 2.4 GHz 8 dBm GPIO, I2C, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C IPEX 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Ezurio Multiprotokoll-Module BL651 Series - Bluetooth v5 Module, Int. Antenna (Nordic nRF52810) Tape & Reel
Datenblatt
1 998erwartet ab 08.09.2026
MouseReel verfügbar
Min.: 1
Mult.: 1
: 1 000

BL651 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.7 V 3.6 V - 40 C + 85 C PCB 14 mm x 10 mm x 2.1 mm Bluetooth LE Reel, Cut Tape, MouseReel
Ezurio Multiprotokoll-Module BL651 Series - Bluetooth v5 Module, Int. Antenna (Nordic nRF52810) Cut Tape
Datenblatt
Vorlaufzeit 16 Wochen
Min.: 1
Mult.: 1

BL651 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.7 V 3.6 V - 40 C + 85 C PCB 14 mm x 10 mm x 2.1 mm Bluetooth LE Cut Tape
Ezurio Multiprotokoll-Module BL5340 series - Multi-Core / Protocol Bluetooth + 802.15.4 + NFC Module (Nordic nRF52340) - Integrated Antenna (Cut Tape)
Datenblatt
863erwartet ab 19.06.2026
Min.: 1
Mult.: 1

BL5340 2.4 GHz 3 dBm ADC, GPIO, I2C, I2S, SPM, UART, USB 1.7 V 5.5 V - 40 C + 105 C Integrated 15 mm x 10 mm x 2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
500erwartet ab 19.06.2026
Min.: 1
Mult.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
800Auf Bestellung
Min.: 1
Mult.: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Microchip Technology Multiprotokoll-Module Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
Datenblatt
144erwartet ab 24.07.2026
Min.: 1
Mult.: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
NXP Semiconductors Multiprotokoll-Module IW610BHN/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Multiprotokoll-Module IW610BUK/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2 000

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610CHN/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors Multiprotokoll-Module IW610CUK/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2 000

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610FHN/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2 700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610FUK/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2 000

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610GUK/A1ZDI
Datenblatt
25erwartet ab 21.08.2026
Min.: 1
Mult.: 1
: 2 000

IW610GUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
Telink Multiprotokoll-Module Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Ezurio Multiprotokoll-Module Module, BL54L10, Bluetooth LE, Trace ANT, Tape and Reel
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1
Mult.: 1
: 1 000
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C Trace 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio Multiprotokoll-Module Module, BL54L10, Bluetooth LE, MHF4, Tape and Reel
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1 000
Mult.: 1 000
: 1 000
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C MHF4 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Reel
u-blox Multiprotokoll-Module RTL8720DF, 802.11abgn+BLE, PCB antenna, open CPU
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 1
Mult.: 1
: 500

NORA-W30 32.768 kHz 3 V 3.6 V - 40 C + 105 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape