ARM Cortex M33 Kern Bluetooth-Module – 802.15.1

Ergebnisse: 48
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Menge RoHS ECAD Model Serie
Protokoll
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Schnittstellen-Typ
Ausgangsleistung
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Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Verpackung
Insight SiP Bluetooth-Module – 802.15.1 ISP2053-AX nRF5340 Bluetooth 5.2 LE Audio, DF and Long Range Module
Datenblatt
130Auf Lager
200erwartet ab 23.07.2026
Min.: 1
Mult.: 1
GPIO, I2C, I2S, PWM, SPI, UART 8 dBm 2 Mb/s - 104 dBm 2.43 GHz 1.7 V 5.5 V - 40 C + 105 C Tray
Ezurio Bluetooth-Module – 802.15.1 Lyra 24P - Bluetooth v5.3 PCB Module (20dBm) with RF Trace Pad (Silicon Labs EFR32BG24) - Tape / Reel
Datenblatt
160Auf Lager
1 000erwartet ab 23.12.2026
Min.: 1
Mult.: 1
: 1 000

Lyra 24 BLE I2C, SPI, UART 20 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 105 C Reel, Cut Tape
Ezurio Bluetooth-Module – 802.15.1 Lyra 24S - Bluetooth v5.3 SIP Module with various antenna options (Silicon Labs EFR32BG24) Cut / Tape
Datenblatt
516Auf Lager
Min.: 1
Mult.: 1

Lyra 24 BLE I2C, SPI, UART 10 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 105 C Cut Tape
Ezurio Bluetooth-Module – 802.15.1 Lyra 24S - Bluetooth v5.3 SIP Module with various antenna options (Silicon Labs EFR32BG24) - Tape / Reel
Datenblatt
1 559Auf Lager
Min.: 1
Mult.: 1
: 2 500

Lyra 24 BLE I2C, SPI, UART 10 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 105 C Reel, Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Datenblatt
245Auf Lager
Min.: 1
Mult.: 1

BLE, Bluetooth 5.1 Class 2 I2C, SPI, UART 20 dBm 2 Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Datenblatt
1 157Auf Lager
Min.: 1
Mult.: 1

BLE, Bluetooth 5.1 Class 2 I2C, SPI, UART 20 dBm 2 Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Datenblatt
385Auf Lager
Min.: 1
Mult.: 1

BLE, Bluetooth 5.1 Class 2 I2C, SPI, UART 20 dBm 2 Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth PCB module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8 MHz, 6 dBm, AoA Receive or BLE Long Range PHY Rates(125kbps and 500kbps), LFXO, 512kB, 32kB(RAM), Built-in antenna, 24 GPIO, 105C
Datenblatt
1 922Auf Lager
1 200Auf Bestellung
MouseReel verfügbar
Min.: 1
Mult.: 1
: 100

BLE, Bluetooth 5.4 I2C, SPI, UART 8 dBm 2 Mb/s - 96.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 105 C Reel, Cut Tape, MouseReel
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth PCB module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8MHz, 8dB, PLFRCO, 352kB, 32kB(RAM), Built-in antenna, 25 GPIO, 85C
Datenblatt
1 512Auf Lager
Min.: 1
Mult.: 1

BLE, Bluetooth 5.4 I2C, SPI, UART 8 dBm 2 Mb/s - 96.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 38.4 MHz, 6 dBm, PLFRCO, 352kB, 32kB(RAM), Built-in antenna/RF pin, 24 GPIO, 85C
Datenblatt
2 614Auf Lager
Min.: 1
Mult.: 1

BLE, Bluetooth 5.4 I2C, SPI, UART 6 dBm 2 Mb/s - 95.9 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Tray
Silicon Labs Bluetooth-Module – 802.15.1 BGM210L Wireless Gecko Bluetooth Lighting Module, PCB, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna
Datenblatt
4Auf Lager
Min.: 1
Mult.: 1

MGM210L Bluetooth 5.1 Class 2 I2C, SPI, UART 12.5 dBm 1 Mb/s - 97 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 125 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 BGM210L Wireless Gecko Bluetooth Lighting Module, PCB, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, Built-in Antenna
Datenblatt
172Auf Lager
Min.: 1
Mult.: 1

MGM210L Bluetooth 5.1 Class 2 I2C, SPI, UART 12.5 dBm 1 Mb/s - 97 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 105 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Datenblatt
116Auf Lager
Min.: 1
Mult.: 1

BLE, Bluetooth 5.1 Class 2 I2C, SPI, UART 10 dBm 2 Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth PCB module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8MHz, 8dB, PLFRCO, 352kB, 32kB(RAM), Built-in antenna, 25 GPIO, 85C
Datenblatt
118Auf Lager
8 000erwartet ab 30.06.2026
MouseReel verfügbar
Min.: 1
Mult.: 1
: 1 000

BLE, Bluetooth 5.4 I2C, SPI, UART 8 dBm 2 Mb/s - 96.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Silicon Labs Bluetooth-Module – 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 1 000
Mult.: 1 000
: 1 000

BLE, Bluetooth 5.1 Class 2 I2C 10 dBm 2 Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Reel
Infineon Technologies Bluetooth-Module – 802.15.1 BLE INDUSTRIAL AND IOT
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 29 Wochen
Min.: 1
Mult.: 1
: 500

Bluetooth 5.4 Class 1, Class 2 GPIO, I2C, I2S, SPI, UART 10 dBm 125 kb/s, 500 kb/s, 1 Mb/s, 2 Mb/s - 95 dBm, - 98 dBm, - 101 dBm, - 106 dBm 2.4 GHz 2.75 V 3.6 V - 40 C + 85 C Reel, Cut Tape
Quectel Bluetooth-Module – 802.15.1 Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 1
Mult.: 1

BLE, Bluetooth 5.4 ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART 2.4 GHz 1.71 V 3.8 V - 40 C + 105 C
Quectel Bluetooth-Module – 802.15.1 Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 1
Mult.: 1
BLE, Bluetooth 5.4 UART 2.4 GHz 1.71 V 3.8 V - 40 C + 85 C
Quectel Bluetooth-Module – 802.15.1 BT 5.4 & BLE Mesh, 20 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1 000
Mult.: 250
: 250

BLE, Bluetooth 5.4 ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART 20 dBm 2.4 GHz 1.71 V 3.8 V - 40 C + 105 C Reel
Quectel Bluetooth-Module – 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1 000
Mult.: 250
: 250

BLE, Bluetooth 5.4 ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART 10 dBm 2.4 GHz 1.71 V 3.8 V - 40 C + 105 C Reel
Quectel Bluetooth-Module – 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1 000
Mult.: 1 000
: 1 000
BLE 5.4 I2C, USART 10 dBm - 96 dBm, - 93 dBm, - 103 dBm, - 99 dBm 1.71 V 3.8 V - 40 C + 105 C Reel
Quectel Bluetooth-Module – 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, RF antenna connector
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1 000
Mult.: 1 000
: 1 000
BLE 5.4 I2C, USART 10 dBm - 96 dBm, - 93 dBm, - 103 dBm, - 99 dBm 1.71 V 3.8 V - 40 C + 105 C Reel
Quectel Bluetooth-Module – 802.15.1 BLE 5.4 standalone module w/ chip antenna in LGA FF, 32 KB RAM, 512 KB flash, 18 GPIOs, transmit power = 8 dBm, -40 C to +85 C
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1 000
Mult.: 1 000
: 1 000
I2C, SPI, USART 8 dBm 97 dBm, 93 dBm, 101 dBm, 106 dBm 1.71 V 3.8 V - 40 C + 85 C Reel