3M IC u. Komponentensockel

Ergebnisse: 711
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Produkt Anzahl der Positionen Anzahl der Zeilen Typ Abstand Montage Kontaktüberzug Zeilenabstand Minimale Betriebstemperatur Maximale Betriebstemperatur Serie Verpackung
3M Electronic Solutions Division IC u. Komponentensockel RECPT FOR DIP SOCKET 14 Contact Qty. 30Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 14 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 7.62 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel BURN-IN SOIC SOCKET 16 Leads 26Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 16 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel 0.100" DIP SOCKET 40 Contact Qty. 27Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 40 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel 0.070" DIP SOCKET 28 Contact Qty. 42Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row DIP Socket 1.78 mm Solder Pin Gold 10.16 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel ZIP STRIP - AXIAL 10Auf Lager
Min.: 1
Mult.: 1

35 Position Through Hole Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel Textool QFN .4MM,48P EVEN ROW,W/THRML PI 6Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 48 Position QFN Socket 0.4 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel LASER DIODE SOCKET 3 Contact Qty. 27Auf Lager
Min.: 1
Mult.: 1
Nein
Test & Burn-In Sockets 3 Position Laser Diode Socket 2.54 mm Solder Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel LASER DIODE SOCKET 3 Contact Qty. 67Auf Lager
Min.: 1
Mult.: 1
Test & Burn-In Sockets 3 Position Laser Diode Socket 2.54 mm Solder Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel LASER DIODE SOCKET 4 Contact Qty. 14Auf Lager
Min.: 1
Mult.: 1
Nein
Test & Burn-In Sockets 4 Position Laser Diode Socket 2.54 mm Solder Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel Textool QFN .5MM,64P EVEN ROW,W/THRML PI 38Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 64 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel 40P DUAL WIPE DIPSKT 5 338Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 40 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Tube
3M Electronic Solutions Division IC u. Komponentensockel 40P DUAL WIPE DIPSKT 2 276Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 40 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Tube
3M Electronic Solutions Division IC u. Komponentensockel POWER IN-LINE SOCKET 3contact, 1 piece 55Auf Lager
280Auf Bestellung
Min.: 1
Mult.: 1

Transistor Sockets 3 Position 2 Row Discrete Power In-Line 5.94 mm Solder Gold 8.23 mm - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel 0.100" DIP SOCKET 16 Contact Qty. 103Auf Lager
280Auf Bestellung
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 16 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 7.62 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel 8P DUAL WIPE DIPSKT 5 043Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 8 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 8P DUAL WIPE DIPSKT 22 062Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 8 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 14P DUAL WIPE DIPSKT 7 955Auf Lager
11 200erwartet ab 28.09.2026
Min.: 1
Mult.: 1

DIP / SIP Sockets 14 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 16P DUAL WIPE DIPSKT 4 826Auf Lager
10 000erwartet ab 07.09.2026
Min.: 1
Mult.: 1

DIP / SIP Sockets 16 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 18P DUAL WIPE DIPSKT 8 648Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 18 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 32P DUAL WIPE DIPSKT 2 393Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 32 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel Textool QFN .5MM,32P EVEN ROW,W/THRML PIN 10Auf Lager
20erwartet ab 20.08.2026
Min.: 1
Mult.: 1

Test & Burn-In Sockets 32 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel Textool QFN .4MM,56P EVEN ROW,W/THRML PI 6Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 56 Position QFN Socket 0.4 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel BURN-IN SOIC SOCKET 8 Leads 43Auf Lager
40erwartet ab 02.11.2026
Min.: 1
Mult.: 1

Test & Burn-In Sockets 8 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel .1" INLINE ZIP STRIP Socket 10 Contct Qt 32Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 10 Position 1 Row SIP Socket 2.54 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel RECPT FOR DIP SOCKET 14 Contact Qty. 17Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 14 Position 2.54 mm Through Hole Gold - 55 C + 150 C Each