5G Automotive- und Transportlösungen

Die 5G-Konnektivität für Automotive- und Transportlösungen von Samtec erfüllt die Anforderungen des wachsenden 5G-Netzwerkmarktes. Da die Implementierung des 5G-Netzwerks schnell an Dynamik gewinnt, werden neue Hochleistungsbauteile, Systeme sowie Prüf- und Messgeräte benötigt, um die extrem hohen Frequenzen und hohen Datenraten zu unterstützen, die Technologien wie mmWave, Massive MIMO, Strahlformung und Vollduplex-Anforderungen erfordern. Samtec bietet Hochleistungsverbindungen zusammen mit hohem technischem Know-how zur Unterstützung dieser Anforderungen, einschließlich eines wachsenden Portfolios von Lösungen, die sich hervorragend für Fahrzeuganwendungen eignen.

Ergebnisse: 4 273
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Beschreibung Datenblatt Verfügbarkeit Preis (EUR) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Produkt
Anzahl der Positionen
Abstand
Anzahl der Zeilen
Montage
Montagewinkel
Stackhöhe
Nennstrom
Nennspannung
Maximale Datenrate
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Kontaktüberzug
Kontaktmaterial
Gehäusematerial
Serie
Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
80Auf Lager
Min.: 1
Mult.: 1
: 200

Sockets 160 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8.5 mm, 9.5 mm, 10 mm, 13 mm, 13.5 mm, 15.5 mm, 17.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
147Auf Lager
Min.: 1
Mult.: 1
: 325

Sockets 240 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
69Auf Lager
Min.: 1
Mult.: 1
: 325

Sockets 300 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
138Auf Lager
Min.: 1
Mult.: 1
: 325

Sockets 300 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
106Auf Lager
Min.: 1
Mult.: 1

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 11 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
42Auf Lager
Min.: 1
Mult.: 1

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 16 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
261Auf Lager
Min.: 1
Mult.: 1
: 150

Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 11 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
102Auf Lager
Min.: 1
Mult.: 1
: 100
Headers 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 16 mm 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
64Auf Lager
Min.: 1
Mult.: 1

Headers 240 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 5 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
324Auf Lager
Min.: 1
Mult.: 1
: 375

Sockets 200 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 7 mm, 8 mm, 8.5 mm, 11.5 mm, 12 mm, 14 mm, 16 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
317Auf Lager
Min.: 1
Mult.: 1
: 325

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
225Auf Lager
Min.: 1
Mult.: 1
: 200

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.80 mm Q Strip High-Speed Ground Plane Socket Strip
Datenblatt
94Auf Lager
Min.: 1
Mult.: 1

Sockets 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 5 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Datenblatt
83Auf Lager
Min.: 1
Mult.: 1

Sockets 80 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
65Auf Lager
Min.: 1
Mult.: 1

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 5 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Terminal Strip
Datenblatt
76Auf Lager
Min.: 1
Mult.: 1
: 100

Headers 60 Position 0.5 mm (0.02 in) 2 Row Solder Pin Vertical 16 mm 2 A 175 VAC 25 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTH Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
214Auf Lager
Min.: 1
Mult.: 1
: 325

Sockets 120 Position 1.27 mm (0.05 in) 6 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 12.5 mm, 13 mm, 15 mm, 17 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50MM Q PAIRS HS GRND PLANE
Datenblatt
188Auf Lager
Min.: 1
Mult.: 1

Sockets 60 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 0.50 mm Q Strip High-Speed Ground Plane Socket Strip
Datenblatt
240Auf Lager
Min.: 1
Mult.: 1
: 500
Sockets 120 Position 0.5 mm (0.02 in) 2 Row Solder Straight 2 A 175 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QSH Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header
Datenblatt
166Auf Lager
Min.: 1
Mult.: 1
: 125

Headers 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 14 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header
Datenblatt
51Auf Lager
Min.: 1
Mult.: 1

Headers 120 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 16 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
519Auf Lager
Min.: 1
Mult.: 1
: 325

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
112Auf Lager
Min.: 1
Mult.: 1
: 125

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 12 mm, 13 mm, 13.5 mm, 14.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Datenblatt
208Auf Lager
Min.: 1
Mult.: 1
: 200
Nein
Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Vertical 8 mm, 9 mm, 9.5 mm, 10.5 mm 2.7 A 240 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAM Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket
Datenblatt
192Auf Lager
Min.: 1
Mult.: 1
: 200
Nein
Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Straight 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF Reel, Cut Tape