RZ® Z Series Interposer Compression Connectors

AirBorn / Molex RZ® Z Series Interposer Compression Connectors offer a 250VDC rating, 25mΩ contact resistance rating, and 20 to 175 contacts. The components' patented Z-axis compression contact system features solderless BeCu contacts that are compressed under pressure between parallel printed wiring boards or between a printed wiring board and another electronic component. The RZ connectors are engineered to meet strict performance and reliability requirements. Standard versions are available with 2 to 7 rows, 20 to 175 contacts, 1.27mm contact spacing, and standard heights spanning 0.1" to 0.35”. Custom configurations designed to meet specific application needs are also available, and both standard and custom versions are made in the USA.

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Molex / AirBorn Platine-zu-Platine & Mezzanine-Steckverbinder Low Profile High-Density One Piece Interposer Compression Connector 6Auf Lager
Min.: 1
Mult.: 1

Molex / AirBorn Rechtwinklige Mil Spec-Steckverbinder Z Series Open-Pin Field Compression (z-axis) Interposer Connector, Vertical, 0.050" (1.27mm) Pitch, 0.100" Height, with Through Hole Hardware, 3 Rows, 25 Columns, 75 Circuits Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 3
Mult.: 1

Molex / AirBorn Platine-zu-Platine & Mezzanine-Steckverbinder Low Profile High-Density One Piece Interposer Compression Connector Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 3
Mult.: 1

Molex / AirBorn Platine-zu-Platine & Mezzanine-Steckverbinder Low Profile High-Density One Piece Interposer Compression Connector Nicht-auf-Lager-Vorlaufzeit 22 Wochen

Molex / AirBorn Platine-zu-Platine & Mezzanine-Steckverbinder Low Profile High-Density One Piece Interposer Compression Connector Nicht-auf-Lager-Vorlaufzeit 14 Wochen