IL-WX Board-to-Board SMT Connectors

JAE Electronics IL-WX Board-to-Board SMT Connectors is designed with extremely small spacing and 0.8mm pitch with double row contact arrangement. These board-to-board connectors feature Surface Mount Technology (SMT) contact configuration for automatic mounting. Combinations of socket receptacle (straight) and pin header (straight/right angle) enable vertical and parallel connections. The IL-WX board-to-board SMT connectors are low-profile connectors connected between parallel boards spaced 4.5mm. These SMT connectors operate at -40°C to +85°C temperature range. Applications include video camera and OA equipment.

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JAE Electronics IL-WX-30SB-VF-A1-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 30 pos., Socket receptacle
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Receptacles 30 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-34P-HF-HD-S-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 34 pos., Pin header
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Headers 34 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-6PB-HF-HD-S-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 6 pos., Pin header
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 1
Mult.: 1
Rolle: 1 000

Headers 6 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel, Cut Tape
JAE Electronics IL-WX-8PB-HF-HD-S-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 8 pos., Pin header
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
Min.: 1
Mult.: 1
Rolle: 1 000

Headers 8 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel, Cut Tape
JAE Electronics IL-WX-10PB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 10 pos., Pin header
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 1
Mult.: 1
Rolle: 1 000

Headers 10 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel, Cut Tape
JAE Electronics IL-WX-14SB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder IL-WX Series (0.8 mm Pitch, Board-to-Board Connector)
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Receptacles 14 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-18PB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 18 pos., Pin header
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Headers 18 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-18SB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder IL-WX Series (0.8 mm Pitch, Board-to-Board Connector)
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Receptacles 18 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-20PB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 20 pos., Pin header
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Headers 20 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-24PB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 24 pos., Pin header
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Headers 24 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-24SB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder IL-WX Series (0.8 mm Pitch, Board-to-Board Connector)
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Receptacles 24 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-26SB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder IL-WX Series (0.8 mm Pitch, Board-to-Board Connector)
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Receptacles 26 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-28PB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 28 pos., Pin header
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-30SB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder IL-WX Series (0.8 mm Pitch, Board-to-Board Connector)
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Receptacles 30 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-32PB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 32 pos., Pin header
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Headers 32 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-32SB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder IL-WX Series (0.8 mm Pitch, Board-to-Board Connector)
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Receptacles 32 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-34PB-HF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 34 pos., Pin header
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Headers 34 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-36PB-HF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 36 pos., Pin header
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 1
Mult.: 1
Rolle: 1 000

Headers 36 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel, Cut Tape
JAE Electronics IL-WX-36PB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder IL-WX Series (0.8 mm Pitch, Board-to-Board Connector)
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1 000
Mult.: 1 000
Rolle: 1 000

Headers 36 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel
JAE Electronics IL-WX-36SB-VF-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder IL-WX Series (0.8 mm Pitch, Board-to-Board Connector)
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 1
Mult.: 1
Rolle: 1 000

Receptacles 36 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel, Cut Tape
JAE Electronics IL-WX-20SB-VF-A1-B-E1000E
JAE Electronics Platine-zu-Platine & Mezzanine-Steckverbinder 0.8 mm pitch, SMT, parallel/ vertical, 20 pos., Socket receptacle
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 1
Mult.: 1
Rolle: 1 000

Receptacles 20 Position 0.8 mm (0.031 in) 2 Row Solder Straight 500 mA 200 VAC, 300 VDC - 40 C + 85 C Tin Copper Alloy Polyphenylene Sulfide (PPS) IL-WX Reel, Cut Tape