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Menge RoHS
congatec Entwicklungsplatinen & -kits - x86 Evaluation carrier board for standard SMARC modules based on SMARC Specification 2.1.1
Datenblatt
39Auf Lager
Min.: 1
Mult.: 1

JUMPtec Computer-On-Module - COM JUMPtec COMe-bBD7R E2 D-1539 10G-KR
Datenblatt
Produkt-Kommentare
10Auf Lager
Min.: 1
Mult.: 1
JUMPtec Computer-On-Module - COM JUMPtec COMe-mBTi10 E3827 2GB
Datenblatt
Produkt-Kommentare
40Auf Lager
Min.: 1
Mult.: 1
congatec Computer-On-Module - COM QSEVEN INTEL ATOM E3815 BAY TRAIL
Datenblatt
34Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.
Datenblatt
1Auf Lager
Min.: 1
Mult.: 1
congatec Computer-On-Module - COM Qseven module with Intel Atom E3845 quad core processor with 1.91GHz, 2MB L2 cache, 4GB 1333MT/s DDR3L onboard dual channel memory. No onboard eMMC.
Datenblatt
19Auf Lager
Min.: 1
Mult.: 1

congatec Entwicklungsplatinen & -kits - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
Datenblatt
19Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM QSEVEN INTEL ATOM E3845 BAY TRAIL
Datenblatt
5Auf Lager
Min.: 1
Mult.: 1

congatec Wärmeableitungen Standard passive cooling for Qseven module conga-QA3. All stand-offs are M2.5 threaded.
Datenblatt
87Auf Lager
Min.: 1
Mult.: 1

congatec conga-TEVAL3/COMe 3.1
congatec Entwicklungsboards und Kits - Andere Prozessoren congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40 C to 85 C
Datenblatt
1Auf Lager
5erwartet ab 21.07.2026
Min.: 1
Mult.: 1

JUMPtec Entwicklungsboards und Kits - ARM SMARC Evaluation Carrier 2.0
Datenblatt
3Auf Lager
Min.: 1
Mult.: 1

congatec Entwicklungsboards und Kits - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
Datenblatt
16Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Compact module with Intel Atom x5-E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support. Industrial grade temperature range from -40 C to 85 C.
Datenblatt
20Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).
Datenblatt
1Auf Lager
Min.: 1
Mult.: 1



congatec Wärmeableitungen Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
Datenblatt
7Auf Lager
Min.: 1
Mult.: 1

JUMPtec Computer-On-Module - COM JUMPtec COMe Eval Carrier2 T6 5mm
Datenblatt
Produkt-Kommentare
2Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface
Datenblatt
94Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
Datenblatt
19Auf Lager
Min.: 1
Mult.: 1

JUMPtec Entwicklungsplatinen & -kits - x86 COMe Eval Carrier T7
Datenblatt
Produkt-Kommentare
10Auf Lager
Min.: 1
Mult.: 1
congatec Wärmeableitungen Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0 154Auf Lager
Min.: 1
Mult.: 1

congatec HPC/sILH-CSA-HP-T
congatec CPU- und Chip-Kühler Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
Datenblatt
1Auf Lager
Min.: 1
Mult.: 1
congatec Computer-On-Module - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr
Datenblatt
14Auf Lager
Min.: 1
Mult.: 1

congatec conga-QA3/E3845-4G eMMC16
congatec Computer-On-Module - COM Q7 INTEL ATOM E3845 BAY TRAIL COM TEMP
Datenblatt
10Auf Lager
Min.: 1
Mult.: 1

JUMPtec Computer-On-Module - COM JUMPtec COMe mini Passive Uni Cooler (w/o HSP)
Datenblatt
Produkt-Kommentare
231Auf Lager
Min.: 1
Mult.: 1
congatec Wärmeableitungen Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm
Datenblatt
37Auf Lager
Min.: 1
Mult.: 1